Hardmask materials

ABSTRACT

Hardmask films having high hardness and low stress are provided. In some embodiments a film has a stress of between about −600 MPa and 600 MPa and hardness of at least about 12 GPa. In some embodiments, a hardmask film is prepared by depositing multiple sub-layers of doped or undoped silicon carbide using multiple densifying plasma post-treatments in a PECVD process chamber. In some embodiments, a hardmask film includes a high-hardness boron-containing film selected from the group consisting of Si x B y C z , Si x B y N z , Si x B y C z N w , B x C y , and B x N y . In some embodiments, a hardmask film includes a germanium-rich GeN x  material comprising at least about 60 atomic % of germanium. These hardmasks can be used in a number of back-end and front-end processing schemes in integrated circuit fabrication.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of application Ser. No. 12/631,691filed Dec. 4, 2009, titled HARDMASK MATERIALS naming Rangarajan et al.as inventors, which is incorporated by reference herein in its entiretyand for all purposes.

FIELD OF THE INVENTION

This invention relates to hardmask films for use in semiconductorprocessing. The invention also relates to methods and apparatus forforming such films.

BACKGROUND OF THE INVENTION

Hardmask films are commonly used as sacrificial layers duringlithographic patterning, e.g., during trench and/or via formation in aDamascene process. In Damascene processing, hardmask film is typicallydeposited onto a layer of dielectric that needs to be patterned. A layerof photoresist is deposited over the hardmask film (with an optionalantireflective layer deposited between the hardmask and thephotoresist), and the photoresist is patterned as desired. The lasersare typically used for alignment of the pattern with the underlyingstructures, and, hence, the hardmasks should be substantiallytransparent at the wavelengths used for alignment. After the photoresistis developed, the exposed hardmask film below the pattern is removed,and the exposed dielectric is etched such that recessed features ofrequired dimensions are formed. The remaining hardmask serves to protectthose portions of dielectric that need to be preserved during theetching process. Therefore, the hardmask material should have a goodetch selectivity relative to the dielectric. Reactive ion etching (RIE)which uses halogen-based plasma chemistry is typically employed fordielectric etching.

The etched recessed features are then filled with a conductive material,such as copper, forming the conductive paths of an integrated circuit.Typically, after the recessed features are filled, the hardmask materialis completely removed from the partially fabricated semiconductorsubstrate.

Titanium nitride deposited by physical vapor deposition (PVD) iscurrently commonly used as a hardmask material for this application. Theuse of silicon carbide as a hardmask material has also been reported inU.S. Pat. No. 6,455,409 and U.S. Pat. No. 6,506,692.

SUMMARY

Hardmask films with improved properties and their methods of fabricationare provided. In lithographic applications, hardmask materials with lowstress are needed because materials with highly compressive or tensilestresses lead to buckling or delamination of the hardmask film on thesubstrate, and, consequently, to poor pattern alignment in lithography.In addition to low stress, hardmask materials should have high hardnessand/or high Young's modulus in order to adequately protect theunderlying material, since hardness and modulus typically correlate wellwith high etch selectivity.

This combination of low stress and high hardness (or high modulus) isespecially difficult to achieve, as harder materials typically possesshigher compressive stress. For example, conventionally used titaniumnitride, while being a relatively hard material, has a compressivestress of greater than about 1,000 MPa. The use of suchhighly-compressive hardmask, particularly with soft ultra low-kdielectrics (k=2.8 and less), and particularly to define higher aspectratio features (e.g., features with aspect ratio of 2:1 and higher),leads to poor alignment, and to undesired wiggling of the formedstructures. Silicon carbide, in general, can have a wide range ofphysical properties, and will not possess low stress and high hardnesssimultaneously, unless it is prepared using special deposition processof this invention.

In some aspects of the invention, hardmask materials having low stressand high hardness are provided. In some embodiments, the films have ahardness of at least about 12 GPa, preferably at least about 16 GPa,such as at least about 20 GPa and a stress of between about −600 MPa and600 MPa, such as between about −300 MPa and 300 MPa, most preferablybetween about 0 MPa and 300 MPa. The films are typically substantiallymetal-free and comprise a material selected from the group consisting ofhigh-hardness low-stress doped or undoped silicon carbide,Si_(x)B_(y)C_(z), Si_(x)B_(y)N_(z), Si_(x)B_(y)C_(z)N_(w), B_(x)N_(y),and B_(x)C_(y). These materials can be formed by plasma enhancedchemical vapor deposition (PECVD) and other CVD-based processes.Provided hardmasks can be used in a variety of lithographic schemes infront-end and back-end semiconductor processing applications. Depositionconditions, which provide low-stress high-hardness properties aredescribed. Structural film characteristics that are associated withthese properties are also provided.

In one aspect, a method of forming a high-hardness low-stress hardmaskfilm on a semiconductor substrate comprises receiving the semiconductorsubstrate in a plasma-enhanced chemical vapor deposition (PECVD) processchamber and depositing doped or undoped multi-layer silicon carbide filmusing multiple densifying plasma treatments. The treatments areperformed preferably after deposition of each sublayer of siliconcarbide. In some embodiments, the process includes introducing a processgas comprising a silicon-containing precursor (e.g., tetramethylsilane)into the process chamber and forming a plasma to deposit a firstsublayer of the silicon carbide hardmask film. Next, thesilicon-containing precursor is removed from the process chamber, forexample, by purging the chamber with a purging gas. A plasma treatmentgas is then introduced into the chamber, the plasma is formed, and thesilicon carbide sublayer is plasma-treated to densify the material. Theplasma treatment gas may be the same as the purging gas or these gasesmay be different. Suitable gases for purging and/or plasma treatmentinclude inert gases (e.g., He, Ar), CO₂, N₂, NH₃, and H₂. In someembodiments, He, Ar, H₂ or various mixtures thereof are preferred forboth purging and for plasma treatment. After the first sublayer ofsilicon carbide was plasma-treated, the depositing, purging, andplasma-treatment operations are repeated to form and densify additionalsublayers of silicon carbide. Typically, each sublayer has a thicknessof less than about 100 Å, e.g., less than about 50 Å to allow gooddensification. The method, in some embodiments, involves depositing anddensifying 10 or more sublayers, e.g., 20 or more sublayers to form thehardmask film, which, in some embodiments, has a thickness of betweenabout 1,000 Å and about 6,000 Å.

The multiple plasma treatments improve hardness of the film as comparedwith a single-layer silicon carbide film. In some embodiments, theformed high-hardness low-stress film comprises undoped silicon carbidefilm having high content of Si—C bonding. In some embodiments the ratioof areas of Si—C peak in the IR spectrum relative to Si—H is at leastabout 20. In some embodiments the ratio of areas of Si—C peak in the IRspectrum relative to C—H is at least about 50. Provided silicon carbidefilms also typically have a density of at least about 2 g/cm³. In someembodiments it is preferable to perform plasma post-treatment using highfrequency radio frequency (HFRF) and low frequency radio frequency(LFRF) plasma generation, where the LF/HF power ratio is at least about1.5, e.g., at least about 2.

In another aspect of the invention, the method for forming high-hardnesslow-stress film involves depositing a boron-containing film selectedfrom the group consisting of Si_(x)B_(y)C_(z), Si_(x)B_(y)N_(z),Si_(x)B_(y)C_(z)N_(w), B_(x)N_(y), and B_(x)C_(y). These films can bedeposited by PECVD using appropriate silicon, carbon, andboron-containing precursors. For example, for deposition ofSi_(x)B_(y)C_(z), in one embodiment, a boron-containing precursor (e.g.,B₂H₆) and a precursor comprising carbon and silicon (e.g.,tetramethylsilane) are provided into a PECVD process chamber to form aSi_(x)B_(y)C_(z) film in a plasma. In order to make a high-hardness andlow-stress film, dual frequency plasma with LF/HF power ratio of atleast about 1.5, such as at least about 2, is preferred. In someembodiments, the films are boron-rich, with ratio of BC/[BC+SiC] of atleast about 0.35, as determined by areas of corresponding peaks in theIR spectrum. High-hardness boron-rich Si_(x)B_(y)C_(z) film is prepared,in some embodiments, by flowing B₂H₆ at a flow rate that is at leastabout 2 times greater than the flow rate of tetramethylsilane.Advantageously, boron-containing films can be easily removed afterpatterning is completed by chemical mechanical polishing (CMP) becauseboron-containing films are typically hydrophilic and are susceptible tosolubilization with CMP chemistries.

In another aspect of the invention, a method for forming a GeN_(x)hardmask film is provided. The method comprises, in some embodiments,receiving a semiconductor substrate in a PECVD process chamber andforming a GeN_(x) hardmask film. The film can be formed by flowing agermanium-containing precursor and a nitrogen-containing precursor intoa PECVD process chamber and forming a plasma. In some embodiments theformed GeN_(x) film has a modulus of at least about 100 GPa, and isgermanium-rich. In some embodiments, the germanium-rich film comprisesat least about 60 atomic %, preferably 70 atomic % germanium (excludinghydrogen). The density of the film can exceed 4 g/cm³. Advantageously,the GeN_(x) is substantially transparent at the alignment wavelengthused in lithographic patterning (e.g. in visible and near IR parts ofthe spectrum). In some embodiments, the GeN_(x) film is deposited byforming a plasma in a process gas comprising germane, ammonia andnitrogen, where the germane/ammonia flow rate ratio is at least about0.05. In some embodiments, dual-frequency plasma source is preferablyused to deposit the GeN_(x) film. In some embodiments, the LF/HF powerratio used during deposition is at least about 1. The GeN_(x) film,similarly to other films mentioned above can be used in a number ofprocessing schemes in back-end and front-end semiconductor processing.

In some embodiments, a hardmask film (such as any of the films describedabove) is deposited on a layer of dielectric, e.g., a dielectric havinga dielectric constant of less than about 3, such as less than about 2.8.A layer of photoresist is typically deposited over the hardmask (but notnecessarily in direct contact with the hardmask, as antireflectivelayers may be deposited in between). Next, lithographic patterning isperformed, in which recessed features (a via and/or a trench) are formedin the dielectric layer. After the patterning is completed and thefeatures are filled with metal, the hardmask is removed (e.g., by CMP).In some embodiments the etch selectivity of the hardmask film relativeto dielectric is at least about 8:1, referring to chemistry used to etchvias and/or trenches, which is typically an RIE process.

In other embodiments, a hardmask film (such as any of the filmsdescribed above) is deposited on a layer of polysilicon in front-endprocessing and serves to protect polysilicon during various processingsteps. In some embodiments, the hardmask material is not removed andwill remain in the manufactured device.

These and other features and advantages of the present invention will bedescribed in more detail below with reference to the associateddrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1K show cross-sectional depictions of device structures createdduring an illustrative back-end lithographic process in semiconductordevice fabrication, using hardmasks provided herein.

FIGS. 2A-2E show cross-sectional depictions of device structures createdduring an illustrative front-end lithographic process in semiconductordevice fabrication using hardmasks provided herein.

FIG. 3 is a process flow diagram for a back-end lithographic processsuitable for use with hardmasks provided herein.

FIG. 4 is a process flow diagram for a front-end lithographic processsuitable for use with hardmasks provided herein.

FIG. 5A is a process flow diagram for a method of depositing a siliconcarbide hardmask, in accordance with an embodiment provided herein.

FIG. 5B provides an IR spectrum of a multi-layer silicon carbide filmobtained using multiple densifying plasma post-treatments in comparisonwith a single-layer silicon carbide film. A more prominent Si—C peak isillustrated.

FIG. 5C is an experimental plot for stress and hardness characteristicsof multi-layer silicon carbide films in comparison with single-layerfilms.

FIG. 5D is an experimental plot for stress and Young's moduluscharacteristics of multi-layer silicon carbide films in comparison withsingle-layer films.

FIG. 6A is a process flow diagram for an exemplary processing methodwhich employs boron-containing hardmask in accordance with an embodimentprovided herein.

FIG. 6B is an experimental plot for stress and hardness characteristicsof boron-containing films suitable for hardmask applications.

FIG. 6C is an experimental plot for stress and Young's moduluscharacteristics of boron-containing films suitable for hardmaskapplications.

FIG. 6D is an experimental plot illustrating dependence ofSi_(x)B_(y)C_(z) film hardness on the B₂H₆/tetramethylsilane flow rateratio used during PECVD.

FIG. 6E is an experimental plot illustrating dependence of Young'smodulus and stress parameters of Si_(x)B_(y)C_(z) films on BC/[BC+SiC]IR peak area ratio.

FIG. 6F is an experimental plot illustrating dependence of Young'smodulus and stress parameters of Si_(x)B_(y)N_(z) films on BN/[BN+SiN]IR peak area ratio.

FIG. 6G is an experimental plot illustrating performance ofSi_(x)B_(y)C_(z) films in a contact angle hydrophobicity test incomparison with undoped silicon carbide film. Relatively morehydrophilic nature of Si_(x)B_(y)C_(z) films is illustrated.

FIG. 7 is a process flow diagram for an exemplary processing methodwhich employs GeN_(x) hardmask in accordance with an embodiment providedherein.

FIG. 8 is a schematic representation of a PECVD apparatus capable ofusing low frequency (LF) and high frequency (HF) radio frequency plasmasources that can be used for depositing hardmask films in accordancewith some embodiments of present invention.

FIG. 9 is a schematic representation of a multi-station PECVD apparatussuitable for forming hardmask films in accordance with some embodimentsof present invention.

DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT

Introduction and Overview

Hardmask films for back-end and front-end semiconductor processingapplications are provided. The films comprise materials selected fromthe group consisting of SiC_(x) (doped or undoped), Si_(x)B_(y)C_(z),Si_(x)B_(y)N_(z), Si_(x)B_(y)C_(z)N_(w), B_(x)N_(y), B_(x)C_(y) andGeN_(x).

The materials consist essentially of the elements that are recited inthe corresponding formulas and optionally include hydrogen which is notexplicitly recited. The subscripts x, y, z, and w indicate that thematerials are not necessarily stoichiometric. The materials includedopants only if presence of dopants is explicitly mentioned. Forexample, undoped SiC, (silicon carbide) described herein is a materialwhich consists essentially of silicon and carbon (not necessarily instoichiometric proportions) and optionally includes hydrogen. Doped SiC,further includes a dopant element, such as boron, oxygen, phosphorus, ornitrogen.

In some embodiments materials provided herein have one or more of thefollowing advantageous properties: high hardness, high Young's modulus,and low stress. In preferred embodiments, the materials simultaneouslypossess a combination of high hardness and low stress, making themparticularly well suited for hardmask applications at advancedtechnology nodes (e.g., at 45 nm and less, e.g., at 22 nm technologynode), especially for patterning of mechanically weak ultra low-k (ULK)dielectrics, and for forming recesses with aspect ratios of 2:1 andgreater (e.g., 4:1 and greater).

In some embodiments the hardmask materials have a hardness of at leastabout 12 GPa, such as at least about 16 GPa, e.g., at least about 18 GPaor at least about 20 GPa. Hardness is a well-defined property in thefield of material engineering and can be reliably measured, e.g., by anysuitable apparatus including a nano-indentation device. In someembodiments, in addition to high hardness, the hardmask materials havelow stress of between about −600-600 MPa, such as between about −300 MPaand 300 MPa, between about 0-600 MPa, and most preferably between about0 MPa and 300 MPa.

Compressive and tensile stresses are measured on one scale with positivevalues corresponding to tensile stress and negative values correspondingto compressive stress. On this scale, higher compressive stress ischaracterized by lower negative values, while higher tensile stress ischaracterized by higher positive values. Films having no residual stresscorrespond to zero on this scale. Stress is a well-defined parameterthat can be measured, e.g., using a “Flexus” tool available fromKLA-Tencor Corporation.

Materials having high compressive stress tend to cause buckling of asubstrate, while materials having high tensile stress tend to causedelamination (particularly when adhesion between materials is poor).Both types of stress are not desired in the hardmask materials. However,low and moderate tensile stress (e.g., 200-600 MPa), such as present insome of boron-containing materials described herein, can be toleratedbetter than compressive stress of the same magnitude.

In some embodiments, hardmask films described herein have Young'smodulus of at least about 100 MPa, such as at least about 125 MPa, e.g.,150 MPa and greater. Young's modulus can be measured by standardtechnique using nano-indentation devices.

It is noted that hardmask materials described herein are generallydistinct from materials that are used as dielectric diffusion barrierlayers and etch-stop layers. Dielectric diffusion barrier and etch-stopmaterials are typically relatively soft materials having hardness ofless than about 10 GPa and a dielectric constant that is less than about5. Diffusion barrier layers are preserved in the final integratedcircuit structure, where low dielectric constant is necessary. Incontrast, hardmask materials provided herein do not necessarily need topossess low dielectric constant, and typically have a dielectricconstant of greater than about 4, such as greater than about 5, orgreater than about 6. This is because hardmasks, in many embodiments,are sacrificial layers, which are completely removed from the structureafter patterning, and therefore do not contribute to electricalproperties of the formed integrated circuit. In those embodiments, wherethe hardmasks are not removed from the final structure, they are presentin such locations, where low dielectric constant is not necessary, orwhere the device can tolerate materials with relatively high dielectricconstant. Further, hardmask materials deposited by PECVD are typicallydeposited using significantly higher power in plasma generation thansofter low-k diffusion barrier materials. Structurally, hardmaskmaterials typically are more closely packed and are denser than softerlow-k diffusion barrier materials.

Provided hardmask materials are, in many embodiments, substantiallytransparent at the laser wavelength that is used for pattern alignment(such as at wavelengths in visible and near-IR parts of the spectrum,e.g., at 633 nm).

The thicknesses of deposited hardmask films depend on many parameters,such as on etch selectivity of a particular hardmask material versus theunderlying material, the thickness of underlying material that needs tobe etched, and the etch chemistry used. In general, harder hardmaskmaterials with higher etch selectivity can be deposited to form thinnerfilms than materials with lower hardness and lower etch selectivity.Additionally, thinner hardmask layers made of hard highly-selectivematerials are advantageous because they allow for better opticalalignment due to relatively higher transparency of thinner films. Insome embodiments, the films are deposited to a thickness of betweenabout 100-10,000 Å, such as to between about 500-6000 Å

The provided films possess high etch selectivity relative to dielectrics(such as relative to dielectrics having dielectric constant of 3.0 andless, such as 2.8 and less, or 2.4 and less) in chemistries that areused for via and/or trench etching. Example etch chemistry includes RIEusing plasma formed in a process gas comprising C_(x)F_(y) (e.g., CF₄),inert gas (e.g., Ar) and an oxidizer (e.g., O₂). Other dry etches, suchas plasma etching with a process gas comprising Cl₂ and N₂ may be used.Etch selectivities of at least about 5:1, such as at least about 8:1(i.e. hardmask material is etched at least 8 times slower than thedielectric) can be obtained in some embodiments, such as for a plasmaetch chemistry comprising C_(x)F_(y) mentioned above. In someembodiments provided films can serve as hardmasks during wet etchingoperations, e.g., in selective wet etching of silicon oxide basedmaterials with a wet fluoride etching chemistry.

The dielectrics that can be etched in the presence of exposed hardmaskmaterials provided herein include silicon oxide, carbon-doped siliconoxide (SiCOH), TEOS (tetraethyl orthosilicate)-deposited oxide, varioussilicate glasses, hydrogen silsesquioxane (HSQ), methylsilsesquioxane(MSQ), as well as porous and/or organic dielectrics, which includepolyimides, polynorbornenes, benzocyclobutene, etc. The providedhardmasks are most advantageously used for patterning of mechanicallyweak organic and/or porous dielectrics having dielectric constant of 2.8and less, such as 2.4 and less.

Hardmask materials described herein generally can be deposited using avariety of methods, including CVD-based methods and PVD-based methods.PECVD is a particularly preferred deposition method, and PECVD, whichallows for dual-frequency plasma generation is even more preferred.Apparatuses having high frequency and a low frequency power sourcesinclude SEQUEL® and VECTOR® tools available from Novellus Systems, ofSan Jose, Calif. Low frequency radio frequency (RF) power refers to RFpower having a frequency between 100 kHz and 2 MHz. A typical frequencyrange for LF plasma source is between about 100 kHz to 500 kHz, e.g.,400 kHz frequency may be used. During deposition of the hardmask layers,LF power density typically ranges at about 0.001-1.3 W/cm², inparticular embodiments, at about 0.1-0.7 W/cm². HF power typicallyranges at about 0.001-1.3 W/cm² and in particular embodiments, at about0.02-0.28 W/cm². High frequency power refers to RF power with afrequency greater than 2 MHz. Typically HF RF frequency lies in therange of between about 2 MHz-30 MHz. A commonly used HF RF valuesinclude 13.56 MHz and 27 MHz In certain embodiments, the deposition ofhardmasks involves setting LF/HF power ratio of at least about 1, suchas at least about 1.5, e.g., at least about 2.

During PECVD deposition, the reactant gas or vapor is provided to theprocessing chamber typically at a flow rate ranging from 0.001 sccm toabout 10000 sccm, preferably from about 1 sccm to about 1000 sccm, andusing substrate pedestal temperatures ranging from about 20° C. to about500° C., preferably from about 200° C. to about 450° C. In someembodiments, temperatures lower than about 400° C. (e.g., from about200° C. to about 400° C.) are preferable for hardmask deposition.Pressure may range from about 10 mTorr to about 100 Ton, preferably fromabout 0.5 Torr to 5 Torr. It is understood that flow rates of precursorscan vary depending on the size of the substrate and chamber size.

Use in Back-End Processing

Provided films can be used in a variety of hardmask applications. Anexemplary use of hardmask films in back-end processing is illustrated bystructures shown in FIGS. 1A-1K, and by the process flow diagram shownin FIG. 3. Referring to the illustrative process flow of FIG. 3, theprocess starts in 301 by providing a substrate having an exposeddielectric layer. The substrate is typically a semiconductor (e.g.,silicon) wafer having one or more layers of material (such as conductorsor dielectrics) residing thereon. The exposed portion of the substratecontains a layer of dielectric that needs to be patterned with vias andtrenches. The hardmasks provided herein can be generally used inpatterning of a variety of dielectric materials listed in the previoussection. It is particularly advantageous to use provided hardmaskmaterials for patterning ULK dielectrics with dielectric constant of 2.8and less, such as 2.4 and less, including mechanically less strongporous and organic dielectrics. As explained above, provided hardmasks,in many embodiments, possess very low stress, and can significantlyreduce buckling and poor pattern alignment, which typically occurs whenhigh-stress hardmask materials are used in patterning of mechanicallyweak ULK dielectrics. It is noted that in some embodiments, a bufferlayer of mechanically stronger material is used between the fragile ULKdielectric and the hardmask. Thus, in some embodiments, the providedsubstrate has an exposed buffer layer (such as a mechanically strongerdielectric) residing on a layer of ULK material. For example, a bufferlayer comprising a dielectric having k of greater than 2.8 can reside ona mechanically less strong dielectric with a lower dielectric constant.For example, a buffer layer comprising a material selected from thegroup consisting of carbon-doped silicon oxide (SiCOH), TEOS (tetraethylorthosilicate)-deposited oxide, various silicate glasses, hydrogensilsesquioxane (HSQ), and methylsilsesquioxane (MSQ), can reside on aporous and/or organic dielectric, which may include polyimides,polynorbornenes, benzocyclobutene, etc. The ULK dielectrics and bufferlayer dielectrics can be deposited, for example, by spin-on methods orby PECVD. In some embodiments the dielectric and/or buffer layer aredeposited in the same PECVD module as the hardmask layer depositedthereon. This provides an additional advantage over titanium nitridehardmasks, which require PVD module for deposition. In operation 303 thehardmask material is deposited onto the dielectric layer (or onto thebuffer layer, which typically is also a dielectric) in a PECVD processchamber. Next, one or more antireflective layers, such as bottomanti-reflective coating (BARC) are optionally deposited, followed bydeposition of photoresist over the hardmask in operation 305. It isnoted that photoresist is not necessarily in direct contact with thehardmask material, since one or more antireflective layers typicallyreside between the hardmask and photoresist. Next, in operation 307 viasand/or trenches are etched in the dielectric layer using the depositedhardmask, and lithographic patterning. Suitable etches include RIEdescribed in the previous section, where the dielectric material isetched in the presence of exposed hardmask having high etch selectivityfor the etch.

A variety of lithographic schemes, which may include deposition andremoval of multiple photoresist layers, deposition of filler layers,etc., may be used to form the desired pattern of recessed features.These lithographic schemes are known in the art, and will not bedescribed in detail. A scheme, which defines a trench first and thenforms a partial via is used as an illustration in FIGS. 1A-1K. It isunderstood, however, that back-end processing can use a variety of otherschemes. After the vias and/or trenches are formed, the vias and/ortrenches are filled with metal (such as electrodeposited copper or itsalloy) in 309, and the hardmask film is removed in operation 311, e.g.,by CMP or appropriate wet or dry etch. In some embodiments, wet etchingor CMP compositions containing a peroxide (such as acidic slurriescontaining hydrogen peroxide) are preferred for hardmask removal.

FIGS. 1A-1K show schematic cross-sectional views of a partiallyfabricated semiconductor substrate during back-end processing, accordingto one illustrative processing scheme. FIG. 1A shows a portion ofsemiconductor substrate (underlying silicon layer and active devices arenot shown) having a copper layer 101 embedded in a first layer ofdielectric 103 (e.g., a ULK dielectric), where a diffusion barrier layer105 (e.g., including Ta, Ti, W, TaN_(x), TiN_(x), WN_(x) or combinationsthereof) resides at an interface between the dielectric and copper. Adielectric diffusion barrier layer (also known as etch-stop layer) 107,such as silicon nitride or nitrogen-doped silicon carbide layer resideson top of copper 101 and dielectric 103. A second dielectric layer 109(e.g., a spin-on or PECVD-deposited ULK dielectric) resides on top ofthe dielectric diffusion barrier layer 107. Because dielectric layer 109can be mechanically weak, and can be damaged during hardmask deposition,a mechanically stronger dielectric buffer layer 111, e.g., TEOSdielectric or carbon-doped silicon oxide (SiCOH) is deposited onto thelayer 109. The hardmask layer 113, which includes a high-hardnessmaterial described herein, is deposited onto the buffer layer 111 byPECVD. Unlike dielectric diffusion barrier layer 107, the hardmask layer113 is deposited on a surface that does not include exposed metal. Alayer of photoresist 115 is deposited over the hardmask 113 by a spin-onmethod. _([GAA1]) Typically one or more antireflective layers aredeposited immediately between the hardmask and the photoresist. Theselayers are not shown to preserve clarity.

After the photoresist 115 has been deposited, it is patterned usingstandard lithographic techniques, to form an opening having width t,which will be used to form the future trench. The resulting structurewith patterned photoresist layer 115 is shown in FIG. 1B. Next, thehardmask layer 113 residing below the removed photoresist, is opened(etched), forming a pattern of exposed dielectric 111, as shown in FIG.1C. The remaining hardmask will serve to protect the dielectric duringphotoresist removal and subsequent dielectric etch. Next, photoresistlayer 115 is removed from the structure, e.g., by ashing, and astructure having exposed patterned hardmask 113 is formed. At thisstage, patterning to form a via is initiated. To pattern a via, a fillerlayer 117, which may comprise an easily removable dielectric, such asHSQ or MSQ, is deposited over the surface of the structure, filling theopening in the hardmask, as shown in FIG. 1E. Next, a second layer ofphotoresist 119 is deposited over the filler layer 117 (with optionalantioreflective layers in between), to form the structure shown in FIG.1F. The photoresist 119 is then patterned to form an opening havingwidth V, which will be used in formation of a via, as shown in structure1G. Next, the hardmask below the photoresist pattern is removed, and avia is partially etched in the dielectric 109, e.g., using RIE. Thephotoresist 119, and the filler layer 117 are removed, forming astructure having a partially etched via and a defined trench, shown inFIG. 1H. Next, etching of dielectric layers 111 and 109 continues untilthe via reaches the etch stop layer 107, which is then subsequentlyetched through to expose metal layer 101 at the bottom of the via, asshown in FIG. 1I. A layer of diffusion barrier material 105 is thenconformally deposited by PVD to line the substrate within the recessedfeatures and in the field region. This is followed by filling therecessed features with metal 121 (e.g., electrodeposited copper or itsalloy) typically with some overburden in the field, providing astructure shown in FIG. 1J. Next, metal overburden, diffusion barriermaterial 105, hardmask layer 113, and dielectric buffer layer 111 areremoved from the field region of the structure forming a partiallyfabricated device having a metal interconnect residing in low-kdielectric layer 109, as shown in FIG. 1K. In other processing schemes,the buffer layer 111, will not be removed and will remain on thesubstrate.

The processing scheme which involves formation of a partial via, asshown in FIGS. 1A-1K illustrates one possible patterning scheme forlow-k dielectric. Hardmask materials provided herein can be used in avariety of other processing schemes, including both via-first andtrench-first schemes.

Use in Front-End Processing

Another illustrative use of provided hardmasks is protection ofpolysilicon during front-end processing. Polysilicon is widely usedduring formation of active devices (e.g., transistors) on semiconductorwafers. In some embodiments, provided hardmask materials are depositedonto polysilicon, and are used to protect polysilicon during variousprocessing operations used in active device fabrication. Notably, infront-end processing in many embodiments, the provided hardmask layersare not sacrificial and remain in the final device residing in contactwith polysilicon.

An illustrative front-end processing scheme is shown in the process flowdiagram of FIG. 4, and is further illustrated by schematiccross-sectional views of partially fabricated structures shown in FIGS.2A-2E. Referring to FIG. 4, the process starts in 401, which provides asubstrate having an exposed layer of polysilicon residing over layer ofan oxide (e.g., silicon oxide, hafnium oxide, etc.). In otherembodiments, the polysilicon may reside over different active layers.The oxide typically resides on a layer of single-crystal silicon. Inorder to pattern oxide and polysilicon layers, two hardmask layers aredeposited over the polysilicon layer. The first hardmask is depositeddirectly onto the layer of polysilicon and includes a material describedherein, such as SiC_(x) (doped or undoped), Si_(x)B_(y)C_(z),Si_(x)B_(y)N_(z), Si_(x)B_(y)C_(z)N_(w), B_(x)N_(y), B_(x)C_(y) andGeN_(x), as shown in operation 403. The hardmask is deposited by a CVDtechnique, more preferably by PECVD. Next, an ashable hardmask (e.g., ahardmask consisting essentially of carbon (with hydrogen optionallypresent)) is deposited over the first hardmask in operation 405. Theashable hardmask may also be deposited by a CVD technique, such as byPECVD deposition using a hydrocarbon precursor. Next, a layer ofphotoresist is deposited over the ashable hardmask and the photoresistis patterned as desired, as shown in operation 407. One or moreantireflective layers may be optionally deposited between the ashablehardmask and the photoresist, which are not shown to preserve clarity.An illustrative structure having an unpatterned photoresist isillustrated in FIG. 2A, where layer 201 is a layer of single-crystalsilicon. The layer 203, residing on the silicon layer 201 is a layer ofoxide. The layer 205 on top of oxide layer 203 is a layer ofpolysilicon. A hardmask material described herein, 207, resides directlyon top of polysilicon 205, and an ashable hardmask (e.g., a carbonhardmask) 209 resides over the first hardmask layer 207. A layer ofphotoresist 211 resides over the ashable hardmask 209 (optionalantireflective layers in between are not shown). The structure, obtainedafter photoresist patterning is shown in FIG. 2B, which illustrates thatphotoresist is removed at two locations, leaving a portion in-between.

Referring again to FIG. 4, the process follows in operation 409, byetching a desired pattern in polysilicon and oxide layers using theashable hardmask for patterning. This is illustrated by structures2C-2E. In structure 2C, the ashable hardmask layer 209 is opened(etched) at the portions exposed after photoresist patterning. Next, thephotoresist 211 is removed completely, and first hardmask layer 207, thepolysilicon layer 205 and the oxide layer 203 are etched at the portionsthat are not protected by the ashable hardmask layer 209, providing astructure shown in FIG. 2D.

Referring again to FIG. 4, in operation 411, the ashable hardmask isremoved, e.g., by oxygen plasma treatment, while leaving the firsthardmask layer containing a material selected from the group consistingof SiC_(x) (doped or undoped), Si_(x)B_(y)C_(z), Si_(x)B_(y)N_(z),Si_(x)B_(y)C_(z)N_(w), B_(x)N_(y), B_(x)C_(y) and GeN_(x) on thepolysilicon layer. The resulting structure is shown in FIG. 2E. Thehardmask layer 207, can be retained during subsequent front-endprocessing and can serve to protect polysilicon during a variety ofsubsequent operations, such as during implantation of dopants into thecrystalline silicon. It is noted that the hardmask material in thedescribed process sequence does not perform actual masking (which isaccomplished by ashable hardmask 209) but is used mainly for protectionof polysilicon. Depending on the integration scheme, the hardmask 207may be used for masking in subsequent front-end operations, such asduring dry or wet etching in cleaning, or during etching of an oxideperformed to define a gate. The hardmask material may be eventuallyremoved from the final device, or may remain in the device, depending onthe integration scheme that is used.

The back-end and front-end applications illustrated above are providedas exemplary sequences, and it is understood that provided materials canbe used in a variety of other processes where high-hardness materialsare desired for protection of underlying layers.

Preparation of suitable hardmask materials will now be described indetail.

Multi-Layer Silicon Carbide Film

In one embodiment, a multi-layer silicon carbide film having highhardness and low stress is provided. Specifically, the film has, in someembodiments, hardness of greater than about 12 GPa, such as greater thanabout 18 GPa and stress of between about −600 MPa-600 MPa, such asbetween about −300 MPa-300 MPa. The film is formed by depositingsub-layers of doped or undoped silicon carbide material, and performinga densifying plasma post-treatment after deposition of each sublayer.

While silicon carbide can be deposited using a variety of methods, insome embodiments, it is preferable to deposit sublayers and to performplasma post-treatment in one PECVD apparatus. The thickness of eachsublayer is typically less than about 100 Å, such as less than about 50Å, to allow for more complete densification of material. The depositioncan involve formation and plasma treatment of any number of sublayers toachieve suitable hardmask thickness. In some embodiments, at least 2sublayers, such as at least 10 sublayers, or at least about 20 sublayersare deposited.

An exemplary process flow diagram for formation of multi-layer siliconcarbide film is shown in FIG. 5A. In operation 501, a semiconductorsubstrate (e.g., a substrate having an exposed dielectric layer or anexposed polysilicon layer) is provided into a PECVD process chamber. ThePECVD process chamber contains inlets for introduction of precursors,and a plasma generator. In some embodiments, dual-frequency RF plasmagenerator which has HF and LF generator components is preferred.

In operation 503, a first sublayer of doped or undoped silicon carbideis formed, wherein the deposition comprises flowing a silicon-containingprecursor into the process chamber and forming a plasma. In one example,dual frequency plasma, where HF RF frequency is about 13.56 MHz and LFRF frequency is 400 kHz is used. The HF power density in this example isabout 0.04-0.2 W/cm², and LF power density is about 0.17-0.6 W/cm².

A variety of silicon-containing precursors may be used, includingorganosilicon precursors, such as alkylsilanes, alkenylsilanes, andalkynylsilanes. In some embodiments, saturated precursors, such astetramethylsilane, tri-iso-propylsilane, and 1,1,3,3-tetramethyl1,3-disilacyclobutane, are preferred.

In some embodiments, silicon-containing precursor includes carbon, as inthe examples above. In other embodiments, a carbon-freesilicon-containing precursor (e.g., silane) and a separatecarbon-containing precursor (e.g., hydrocarbon) may be used in theprocess gas. Further, in some embodiments, the process gas may include ahydrocarbon and an organosilicon precursor.

The silicon-containing precursor is typically introduced into theprocess chamber with a carrier gas, e.g., with an inert gas such as He,Ne, Ar, Kr or Xe. In some embodiments, H₂ can be included in thedeposition process gas. In one example, a deposition process gasconsists essentially of tetramethylsilane (flowed at a rate of about500-2,000 sccm) and helium (flowed at a rate of about 3-5 slm).

If a layer of doped silicon carbide needs to be formed, a suitabledopant is added to the process gas. For example, N₂, NH₃, N₂H₄, anamine, or a different nitrogen-containing precursor can be added to theprocess gas to form a nitrogen-doped silicon carbide. Boron-containingprecursor such as diborane, may be added to form a boron-containingsilicon carbide. Phosphorus-containing precursor (e.g., PH₃) may beadded to form a phosphorus doped silicon carbide.

After the plasma is ignited and silicon carbide sublayer has been formedto a desired thickness, in operation 505, the silicon-containingprecursor is removed from the process chamber. This is accomplished insome embodiments by purging the process chamber with a purging gas,which may contain a gas selected from the group consisting of inertgases (e.g., He, Ar), CO₂, N₂, NH₃, H₂, and mixtures thereof. In someembodiments, He, Ar, H₂ or various mixtures thereof are preferred as apurging gas. In operation 507, after the silicon-containing precursor iscompletely removed, a plasma-treatment process gas (which may be same ordifferent from the purging gas) is introduced into the process chamberand the first sublayer is treated with plasma, preferably underconditions in which LF/HF power ratio is at least about 1.5, such as atleast about 2. In operation 509, deposition and plasma post-treatmentsare repeated to form a multi-layer film containing at least 2 sublayers,such as at least 10 sublayers. Plasma post-treatment of each sublayer isperformed for a period of time that is needed for film densification,and may depend on the sublayer thickness. In some embodiments, plasmapost-treatment is performed for about 5-25 seconds, such as about 8-15seconds for each sublayer.

The resulting film was found to have structure and properties that aredistinct from those of conventional silicon carbide films. It wasunexpectedly discovered that multi-layer films prepared with multipledensifying plasma post-treatments, can possess high hardness and lowstress simultaneously, which could not be achieved by conventionaldeposition methods.

Structural characterization of these films shows that Infra-Red (IR)spectra of such films have characteristically high Si—C/Si—H andSi—C/C—H peak ratios, where the ratios refer to the ratios ofcorresponding IR peak areas, centered at about 760-800 cm⁻¹ (Si—C),2070-2130 cm⁻¹ (Si—H), and 2950-3000 cm⁻¹ (C—H).

In some embodiments the ratio of areas of Si—C peak in the IR spectrumrelative to C—H is at least about 50 and the Si—C/Si—H ratio is at leastabout 20. Provided films also typically have a density of at least about2 g/cm³.

FIG. 5B shows IR spectra of a single-layer undoped silicon carbide filmobtained without plasma post-treatment (curve a) and of a multi-layerundoped silicon carbide film obtained with multiple densifying plasmatreatments (curve b). Single-layer film was deposited on a 300 mm waferby flowing a process gas containing tetramethylsilane (at 1,000 sccmflow rate) and helium (at 3000 sccm flow rate) at a pressure of 2.1 TOMDual-frequency plasma at LF power density of about 0.25 W/cm² and HFpower density of about 0.13 W/cm² was used during deposition. Amulti-layer film was deposited under the same conditions for sublayerdeposition, but additionally included plasma post-treatments afterdeposition of each sub-layer. Post-treatment involved flowing argon as apost-treatment gas into the process chamber at a rate of 3 slm at achamber pressure of 2.1 Torr and forming a dual-frequency plasma at LFpower density of about 0.25 W/cm² and HF power density of about 0.13W/cm². The resulting single layer film was characterized by SiC/SiH arearatio of about 15. The resulting multi-layer film formed with densifyingplasma treatments was characterized by SiC/SiH IR peak area ratio ofabout 24. The multi-layer film had Young's modulus of about 170 GPa andhardness of about 20.4 GPa, whereas the single-layer film had Young'smodulus of about 95 GPa and hardness of only about 12 GPa. Thesingle-layer film and the multi-layer film had stress values of −20 MPaand 179 MPa respectively.

FIG. 5C illustrates stress and hardness values for two multi-layerundoped silicon carbide films prepared using densifying plasmapost-treatments and for two single-layer undoped silicon carbide filmsprepared without post-treatment. FIG. 5D illustrates stress and Young'smodulus values for the same films. Table 1 summarizes deposition andpost-treatment conditions for the films.

TABLE 1 Hard- Stress, ness, Modulus, Film Deposition Post-Treatment MPaGPa GPa Film LF = 0.35 W/cm² No −830 22.4 180 A HF = 0.13 W/cm² Film LF= 0.53 W/cm² LF = 0.53 W/cm² −412 20.86 166 B HF = 0.13 W/cm² HF = 0.13W/cm² Film LF = 0.23 W/cm² LF = 0.23 W/cm² 179 20.4 170 C HF = 0.13W/cm² HF = 0.13 W/cm² Film LF = 0.23 W/cm² No −20 12 96 D HF = 0.13W/cm²

All films were prepared using a mixture of tetramethylsilane and heliumas a deposition process gas at a pressure of about 2 Torr.Dual-frequency plasma generation was used in all cases for deposition.The power densities for HF and LF plasma are listed in the table, wherethe power density is calculated by dividing the power by substrate area.Films A and D were single-layer films prepared without plasmapost-treatment. It can be seen that these films do not possess highhardness and low stress at the same time. For example, Film A, whilebeing relatively hard (22.4 GPa), has a very high compressive stress of−830 MPa. Film D, while having small stress (−20 MPa), possesses onlymoderate hardness of 12 GPa.

Films B and C are multi-layer films, where plasma post-treatment wasperformed after deposition of each silicon carbide sublayer. Argon wasused as plasma treatment gas at a pressure of about 2 Torr.Dual-frequency plasma generation was used for plasma post-treatment. Thepower densities for HF and LF plasma are listed in the table.Unexpectedly, multi-layer films were found to have both high hardness(and/or modulus) and low stress. For example, Film B has a hardness of20.86 GPa and a stress of −412 MPa (which is more than 2 times lowerthan stress of Film A). Further, multi-layer Film C has a high hardnessof 20.4 GPa and a tensile stress of 179 MPa. The hardness of Film C ismore than 1.5 times greater than the hardness of film D. It is notedthat, except for plasma post-treatment, Films C and D are depositedunder identical conditions. It can be seen that plasma post-treatmentmakes the films harder without unacceptably increasing compressivestress of the films.

In some embodiments, it is preferable to perform post-treatment ofsilicon carbide sub-layers using dual frequency plasma where LF power isgreater than HF power, such as LF/HF power ratio is at least about 1.5,or at least about 2. Unexpectedly, increase in the ratio of LF/HF powersused during post-treatment, improves properties of the obtained films.Increased LF/HF power ratio increases refractive index of the obtainedfilms, a parameter, which positively correlates with film hardness. Insome embodiments, multi-layer silicon carbide films having refractiveindex of at least about 2.25, such as at least about 2.30 are provided.Increase in refractive index of the film with increasing LF/HF powerratio is illustrated in Table 2.

TABLE 2 Film Post-treatment HF Post-treatment LF ID power per station, Wpower per station, W Refractive Index 1 114 211 2.3021 2 325 0 2.2308 3114 111 2.2527Boron-Containing Hardmask Films

In another aspect, boron-containing hardmask films are provided.Boron-containing films include a material selected from the groupconsisting of Si_(x)B_(y)C_(z), Si_(x)B_(y)N_(z), Si_(x)B_(y)C_(z)N_(w),B_(x)N_(y), and B_(x)C_(y). In some embodiments, these materials areengineered to have high hardness (e.g., hardness of at least about 12GPa, preferably at least about 16 GPa) and low stress (e.g., stress ofbetween about −600 and 600 MPa, preferably of between about −300 and 300MPa). Advantageously, in some embodiments, boron-containing films havingno compressive stress, such as films with very low tensile stress (e.g.,between about 0-300 MPa) are provided. Further, boron-containing filmsare typically more hydrophilic than undoped silicon carbide films, andcan be more easily removed by CMP (e.g., using acidic slurriescontaining hydrogen peroxide). In general, boron-containing hardmaskscan be prepared by a variety of methods, such as by CVD-based techniquesand by PVD-based techniques. In some embodiments, PECVD is preferred forpreparation of a boron-containing hardmask.

Referring to FIG. 6, an exemplary process flow for using aboron-containing hardmask in back-end processing. The process starts in601 by providing a semiconductor substrate comprising an exposeddielectric layer in a PECVD process chamber. The dielectric layer maybe, for example, an ultra-low k dielectric layer (e.g., with k less thanabout 2.8, such as less than about 2.4) or a buffer dielectric layerwith higher dielectric constant.

In operation 601 a high-hardness low-stress boron-containing hardmaskfilm selected from the group consisting of Si_(x)B_(y)C_(z),Si_(x)B_(y)N_(z), Si_(x)B_(y)C_(z)N_(w), B_(x)N_(y), and B_(x)C_(y) isdeposited. The deposition is performed by flowing a process gascomprising appropriate precursors into the process chamber and forming aplasma. In some embodiments dual frequency plasma is preferred. In someembodiments, particularly good film parameters are obtained when powerdensity for LF plasma is greater than power density for HF plasma, e.g.,at LF/HF power ratios of at least about 1.5, such as at least about 2.

After the film has been deposited, the dielectric is patterned in 605,to form trenches and/or vias, e.g., as was described with reference toFIGS. 1A-1K. Boron-containing films can serve as hardmasks during dryetch of dielectric with RIE. Next, after the vias and/or trenches havebeen formed in the dielectric, they are filled with metal in operation607. Next, the boron-containing hardmask is removed in 609 by CMP,typically following the removal of metal overburden.

PECVD deposition of Si_(x)B_(y)C_(z) can be accomplished by using aprocess gas containing a silicon-containing precursor, aboron-containing precursor, and a carbon-containing precursor. One ormore of these precursors can be the same molecule. For example,tetraalkylsilane can function both as a carbon-containing and as asilicon-containing precursor. Diborane is typically used as aboron-containing precursor, alkylsilanes (e.g., tetramethylsilane),alkenylsilanes, and alkynylsilanes can be used as silicon andcarbon-containing precursors. Further, saturated and unsaturatedhydrocarbons (C_(x)H_(y)) can be used as carbon-containing precursors,and SiH₄ can be used as a silicon-containing precursor.

Deposition of Si_(x)B_(y)C_(z)N_(w) can be accomplished by forming aplasma in a process gas comprising a silicon-containing precursor, aboron-containing precursor, a carbon-containing precursor (as describedabove) and a nitrogen-containing precursor. Nitrogen-containingprecursors can include ammonia, hydrazine, N₂ and mixtures thereof.Further nitrogen-containing precursor may be the same ascarbon-containing precursor and may include amines, such asmonoalkylamines, dialkylamines, and trialkylamines. Nitrogen-containingprecursor may be the same as boron-containing precursor and may includetrimethylborazine. Nitrogen-containing precursor further may be the sameas silicon-containing precursor, e.g., in a silazane.

Deposition of Si_(x)B_(y)N_(w) can be accomplished by forming a plasmain a process gas comprising a silicon-containing precursor (e.g., SiH₄),a boron-containing precursor (e.g., diborane), and a nitrogen-containingprecursor (e.g., ammonia, hydrazine, N₂ and their various mixtures).

B_(x)N_(y) can be deposited using a process gas comprising aboron-containing precursor (e.g., diborane) and a nitrogen-containingprecursor (e.g., ammonia, hydrazine, N₂, and their mixtures).

B_(x)C_(y) can be deposited using a process gas comprising aboron-containing precursor (e.g., diborane) and a carbon-containingprecursor (e.g., a saturated or unsaturated hydrocarbon. An inertcarrier gas, such as helium or argon is typically a part of the processgas used during deposition of these boron-containing films. In someembodiments, H₂ is also included in the process gas.

FIG. 6B illustrates hardness and stress parameters for variousPECVD-deposited Si_(x)B_(y)C_(z), Si_(x)B_(y)N_(z),Si_(x)B_(y)C_(z)N_(w) films. FIG. 6C illustrates Young's modulus andstress parameters for the same films. Deposition conditions andproperties of obtained films are listed in Table 3.

TABLE 3 B₂H₆/4MS Hard- Mod- Flow rate Stress, ness, ulus, Film Processgas ratio MPa GPa GPa 1. Si_(x)B_(y)C_(z)N_(w) B₂H₆, 4MS, NH₃, −555 14.5125 N₂ 2. Si_(x)B_(y)N_(z) B₂H₆, SiH₄, NH₃, −256 13.12 126 N₂ 3.Si_(x)B_(y)N_(z) B₂H₆, SiH₄, NH₃, −65 13.72 138 N₂ 4. Si_(x)B_(y)C_(z)B₂H₆, 4MS, He 3.5 416 17.3 163 5. Si_(x)B_(y)C_(z) B₂H₆, 4MS, He, H₂ 3.5−284 23.54 227 6. Si_(x)B_(y)C_(z) B₂H₆, 4MS, He 3.5 246 17.9 174 7.Si_(x)B_(y)C_(z) B₂H₆, 4MS, He 0.5 211 12.29 103 8. Si_(x)B_(y)C_(z)B₂H₆, 4MS, He 1.5 430 15.15 138

All films were deposited on a 300 mm wafer at a pressure ranging fromabout 2 to about 4 torr, using dual frequency plasma, where HFRF powerdensity ranged from about 0.08 to about 0.30, and LFRF power densityranged from about 0.10 to about 0.24 W/cm².

In one embodiment Si_(x)B_(y)C_(z) film is deposited using a process gasconsisting essentially of B₂H₆, tetramethylsilane (4MS), and He. B₂H₆flow rate can be in the range of between about 2,000-4,000 sccm,preferably between about 3,500-4,000 sccm, while flow rate oftetramethylsilane can range between about 1,000-1,500 sccm. A carriergas (e.g., He) flow rate of between about 3-8 slm is preferably used.Dual frequency plasma at HFRF power density of between about 0.04-0.26W/cm² and LFRF power density of between about 0.14-0.53 W/cm² is used insome embodiments.

It was unexpectedly discovered that the hardness of obtained films ishighly dependent on the ratio of B₂H₆ and tetramethylsilane (4MS).Preferably B₂H₆/4MS flow rate ratio of at least about 2, e.g., of atleast about 3 is used in order to obtain high-hardness boron-rich films.

FIG. 6D illustrates hardness of Si_(x)B_(y)C_(z) films as a function ofB₂H₆/4MS flow rate ratio. It can be seen that hardness can be increasedby about 2-fold by raising the flow-rate ratio from about 0.5 to about3.5. Corresponding hardness and stress values for different flow-rateratios are shown in Table 3.

Structurally, films with high hardness and high Young's modulus arecharacterized by high B—C bond content. High-hardness films having theratio of BC/[BC+SiC] IR peak areas of at least about 0.35, are preferredin some embodiments. The ratio refers to the ratio of corresponding IRpeak areas, centered at about 1120-1160 cm⁻¹ (B—C), and 760-800 cm⁻¹(Si—C).

FIG. 6E illustrates the dependence of Young's modulus and stressparameters of various Si_(x)B_(y)C_(z) films as a function ofBC/[BC+SiC] area ratio. It can be seen that the films having BC/[BC+SiC]of less than about 0.3 are significantly softer than films with higherB—C bond content. Table 4 summarizes obtained data on threeSi_(x)B_(y)C_(z) films. All three films were deposited using the processgas consisting of B₂H₆ (flow rate varied from 500 to 3500 sccm), 4MS(1,000 sccm flow rate), and He (3,000 sccm flow rate) using dualfrequency plasma at HFRF power density of about 0.12 W/cm² and LFRFpower density of about 0.22 W/cm² at a pressure of 2.1 Torr. Thehardness, stress, and Young's modulus parameter as a function of B—Ccontent are illustrated in Table 4.

TABLE 4 Hardness, Modulus, Film BC/[BC + SiC] Stress, MPa GPa GPa 1.Si_(x)B_(y)C_(z) 0.386 439 17.3 163 2. Si_(x)B_(y)C_(z) 0.22 211 12.29103 3. Si_(x)B_(y)C_(z) 0.364 418 15.15 138

In some embodiments, it is preferable to deposit Si_(x)B_(y)C_(z) usingdual frequency plasma where LF power is greater than HF power, such asLF/HF power ratio is at least about 1.5, at least about 2, e.g., atleast about 3. It was discovered that increase in the ratio of LF/HFpowers used during deposition improves properties of the obtained films.Increased LF/HF power ratio increases refractive index of the obtainedfilms, which positively correlates with film hardness. In someembodiments, Si_(x)B_(y)C_(z) films having refractive index of at leastabout 2.3, such as at least about 2.5, e.g., at least about 2.6 areprovided. Increase in refractive index of the film with increasing LF/HFpower ratio is illustrated in Table 5.

TABLE 5 Film ID LF/HF power ratio Refractive Index I. Si_(x)B_(y)C_(z)1.86 2.518 II. Si_(x)B_(y)C_(z) 4.33 2.5714 III. Si_(x)B_(y)C_(z) 3.052.6131 IV. Si_(x)B_(y)C_(z) 0.81 2.3382

In Si_(x)B_(y)N_(z) films, an important structural characteristic of thefilm, is the content of B—N bonds, which is quantified using theBN/[BN+SiN] ratio of areas of peaks in the IR spectrum, where the ratiorefer to the ratio of corresponding IR peak areas, centered at about1400 cm⁻¹ (B—N), and 820-850 cm⁻¹ (Si—N).

FIG. 6F shows that both stress and Young's modulus are highly dependenton this parameter. Specifically compressive stress rapidly increaseswith increasing B—N bond content. In some embodiments, Si_(x)B_(y)N_(z)films with BN/[BN+SiN] of less than about 0.7, such as less than about0.6 are preferred. The B—N bond content can be adjusted as needed byappropriately modifying the flow rates of silicon-containing andboron-containing precursors. Table 6 illustrates film properties forfilms having different BN/[BN+SiN] ratios.

TABLE 5 Hard- Modu- BN/ Stress, ness, lus, Film Process gas [BN + SiN]MPa GPa GPa 1. Si_(x)B_(y)N_(z) B₂H₆ (4125 sccm), 0.77 −431 12.89 120SiH₄ (300 sccm), NH₃ (825 sccm), N₂ (16,500 sccm) 2. Si_(x)B_(y)N_(z)B₂H₆ (4125 sccm), 0.66 −256 13.12 126 SiH₄ (75 sccm), NH₃ (825 sccm), N₂(16,500 sccm) 3. Si_(x)B_(y)N_(z) B₂H₆ (4125 sccm), 0.59 −65 13.72 138SiH₄ (150 sccm), NH₃ (825 sccm), N₂ (16,500 sccm)

As it was previously mentioned, boron-containing films are well suitedfor hardmask application. One of distinct advantages of boron-containingfilms is their hydrophilic nature, and ease of removal by CMP. FIG. 6Gillustrates hydrophilicity of various Si_(x)B_(y)C_(z) films incomparison with undoped silicon carbide film using contact angle test,in which a drop of water is placed on the film. A contact angle of thedrop on the film is measured, with lower contact angle corresponding tomore hydrophilic films. Si_(x)B_(y)C_(z) films 4-6 listed in Table 3were tested, and contact angles of 38-42° were obtained. In contrast,undoped silicon carbide film is significantly more hydrophobic, asevidenced by a significantly higher contact angle of 66°.

Germanium Nitride Hardmask Films

In another aspect, GeN_(x) hardmask films are provided. These films insome embodiments are characterized by high Young's modulus of at leastabout 100 GPa, such as at least about 130 GPa and high density (e.g.,density of greater than about 4 g/cm³). GeN_(x) films can be used ashardmasks in a variety of back-end and front-end processing schemes, aresufficiently transparent at wavelengths used for pattern alignment withlasers, and can be easily removed from the substrate after use by CMP orwet etching techniques.

In some embodiments, germanium-rich GeN_(x) hardmask films arepreferably used. Such germanium-rich films have germanium concentrationof at least about 60 atomic %, such as at least about 70 atomic %, e.g.,at least about 75 atomic % excluding hydrogen. High germanium contentmakes the germanium nitride film more susceptible to CMP and wet etchingremoval after the film has been used in patterning. Removal, in someembodiments, is accomplished by contacting the hardmask with acomposition comprising hydrogen peroxide in a CMP or a wet etchingoperation. For example, acidic CMP slurries containing hydrogen peroxidemay be used.

In one example, GeN_(x) hardmask film having germanium concentration ofabout 79 atomic % germanium, Young's modulus of about 144 GPa and adensity of about 4.4 g/cm³ was prepared.

Germanium nitride hardmasks generally can be prepared using a variety ofCVD and PVD techniques, of which PECVD will be described as anillustrative example. Making reference to the back-end process flowdiagram shown in FIG. 7, the process starts in 701 by providing asemiconductor substrate comprising an exposed dielectric layer in aPECVD process chamber. In operation 703, a GeN_(x) hardmask film with agermanium content of at least about 60 atomic % is deposited. Depositionis performed by introducing a process gas comprising agermanium-containing precursor (e.g., germane) and a nitrogen-containingprecursor (e.g., NH₃, N₂, N₂H₄, and various mixtures thereof) into theprocess chamber and forming a plasma to deposit a germanium nitridelayer. The deposition process gas may optionally include an inert gas,such as helium or argon. The ratio of flow rates of anitrogen-containing precursor and of a germanium-containing precursor isselected such as to form a germanium-rich germanium nitride film. In oneexample, where the precursors are germane and ammonia, the ratio ofgermane to ammonia of at least about 0.05 is used.

In one illustrative example, a GeN_(x) hardmask is prepared on a 300 mmwafer by flowing a process gas consisting essentially of germane (at aflow rate of between about 50-100 sccm), NH₃ (at a flow rate of betweenabout 600-1200 sccm) and N₂ (at a flow rate of about 12 slm) into theprocess chamber and forming a dual-frequency plasma to deposit thegermanium nitride film on a substrate at a temperature of between about350-450° C., where the temperature refers to the temperature at thepedestal. The pressure during deposition in this illustration is betweenabout 2.5-4 Torr. The HF RF component at a frequency of about 13.56 MHz(at a power density of about 0.18 W/cm²) and LF RF component at afrequency of about 400 kHz (at a power density of about 0.23 W/cm²) isused in this illustrative deposition process. In some embodiments it ispreferable to use LF component at a greater power density than HFcomponent.

Referring again to the process flow diagram of FIG. 7, after thegermanium nitride film has been deposited, the dielectric is patternedin operation 707 to form trenches and/or vias, e.g., as described inFIGS. 1A-1K. The germanium nitride hardmask can be used during dry etchpatterning, such as during Reactive Ion Etching (RIE) of dielectric. Forexample, vias and/or trenches can be etched in the dielectric in thepresence of exposed GeN_(x) hardmask by contacting the substrate havingexposed hardmask and dielectric layers, with a plasma using a processgas comprising C_(x)F_(y) (e.g., CF₄), inert gas (e.g., Ar) and anoxidizer (e.g., O₂). Other dry etches, such as plasma etching with aprocess gas comprising Cl₂ and N₂ may be used.

After the dielectric has been patterned, the vias and/or trenches arefilled with metal in operation 707. For example, copper can be depositedby electroplating, into the recessed features. Next in operation 709,the hardmask is removed by CMP. For example, this can be accomplishedduring CMP-removal of copper overburden and diffusion barrier material.In some embodiments a CMP slurry having acidic pH, and comprising aperoxide (such as hydrogen peroxide) is used for removal of GeN_(x)hardmask. In other embodiments, GeNx hardmask film can be removed by wetetching (e.g., with solutions comprising H₂SO₄ and H₂O₂ that can bepresent in a 3:1 ratio)

The process flow diagram in FIG. 7 illustrates a back-end processingscheme. GeN_(x) film can be also used as a hardmask in front-endprocessing. Further, germanium nitride film can serve as a hardmaskduring wet etching, e.g., during patterning of silicon oxide-basedmaterials with fluoride-containing wet etching chemistry.

Apparatus

The hardmask materials described herein generally can be deposited indifferent types of apparatus, including CVD and PVD apparatuses. In apreferred embodiment, the apparatus is a PECVD apparatus which includesHFRF and LFRF power source. Examples of suitable apparatuses includeSEQUEL® and VECTOR® tools commercially available from Novellus Systems,Inc. located in San Jose, Calif.

Generally, the apparatus will include one or more chambers or “reactors”(sometimes including multiple stations) that house one or more wafersand are suitable for wafer processing. Each chamber may house one ormore wafers for processing. The one or more chambers maintain the waferin a defined position or positions (with or without motion within thatposition, e.g. rotation, vibration, or other agitation). In someembodiments, a wafer undergoing hardmask layer deposition is transferredfrom one station to another within the reactor during the process. Whilein process, each wafer is held in place by a pedestal, wafer chuckand/or other wafer holding apparatus. For operations in which the waferis to be heated, the apparatus may include a heater such a heatingplate.

FIG. 8 provides a simple block diagram depicting various reactorcomponents of a suitable PECVD reactor arranged for implementing thepresent invention. As shown, a reactor 800 includes a process chamber824, which encloses other components of the reactor and serves tocontain the plasma generated by a capacitor type system including ashowerhead 814 working in conjunction with a grounded heater block 820.A high-frequency RF generator 804 and a low-frequency RF generator 802are connected to a matching network 806 that, in turn is connected toshowerhead 814.

Within the reactor, a wafer pedestal 818 supports a substrate 816. Thepedestal typically includes a chuck, a fork, or lift pins to hold andtransfer the substrate during and between the deposition reactions. Thechuck may be an electrostatic chuck, a mechanical chuck or various othertypes of chuck as are available for use in the industry and/or research.

The process gases are introduced via inlet 812. Multiple source gaslines 810 are connected to manifold 808. The gases may be premixed ornot. Appropriate valving and mass flow control mechanisms are employedto ensure that the correct gases are delivered during the deposition andplasma treatment phases of the process. In case the chemicalprecursor(s) is delivered in the liquid form, liquid flow controlmechanisms are employed. The liquid is then vaporized and mixed withother process gases during its transportation in a manifold heated aboveits vaporization point before reaching the deposition chamber.

Process gases exit chamber 824 via an outlet 822. A vacuum pump 826(e.g., a one or two stage mechanical dry pump and/or a turbomolecularpump) typically draws process gases out and maintains a suitably lowpressure within the reactor by a close loop controlled flow restrictiondevice, such as a throttle valve or a pendulum valve.

In one of the embodiments a multi-station apparatus may be used fordepositing a hardmask layer. The multi-station reactor allows one to rundifferent or same processes concurrently in one chamber environment,thereby increasing the efficiency of wafer processing. An example ofsuch an apparatus is depicted in FIG. 9. A schematic presentation of topview is shown. An apparatus chamber 901 comprises four stations 903-909.In general, any number of stations is possible within the single chamberof a multi-station apparatus. Station 903 is used for loading andunloading of the substrate wafers. Stations 903-909 may have the same ordifferent functions and, in some embodiments, can operate under distinctprocess conditions (e.g., under different temperature regimes).

In some embodiments, the entire hardmask layer is deposited in onestation of an apparatus. In other embodiments, a first portion of thehardmask layer is deposited in a first station, the wafer is thentransferred to a second station, where the second portion of the samehardmask layer is deposited, and so on, until the wafer returns back tothe first station and exits the apparatus.

In one embodiment, deposition of sublayers of silicon carbide, andplasma post-treatment are performed in one of the stations of theapparatus. In other embodiments, deposition of sublayers is performed inone or more dedicated stations, while plasma post-treatment is performedat one or more different stations.

In one embodiment, stations 903, 905, 907, and 909 all serve fordeposition of a hardmask layer. An indexing plate 911 is used to liftthe substrates off the pedestals and to accurately position thesubstrates at the next processing station. After the wafer substrate isloaded at station 903, it is indexed to stations 905, 907, and 909 insuccession, wherein a portion of a hardmask layer is deposited at eachstation. The processed wafer is unloaded at station 903, and the moduleis charged with a new wafer. During normal operation, a separatesubstrate occupies each station and each time the process is repeatedthe substrates are moved to new stations. Thus, an apparatus having fourstations 903, 905, 907, and 909 allows simultaneous processing of fourwafers.

The process conditions and the process flow itself can be controlled bya controller unit 913 which comprises program instructions formonitoring, maintaining and/or adjusting certain process variables, suchas HF and LF power, precursor flow rates, temperature, pressure and thelike. The controller includes program instructions for performing any ofthe hardmask deposition processes described herein. For example, in someembodiments, the controller includes program instructions for depositinga silicon carbide sublayer (i.e., for flowing appropriate process gasand generating a plasma using required power parameters), purging thechamber with a purging gas, plasma treating the sublayer with aplasma-treatment gas, and repeating the depositing and plasma-treatmentprocesses as many times as desired, (e.g., such as at least 10 sublayersare deposited and treated). In some embodiments, the controller includesprogram instructions for depositing a boron-containing hardmask, whichinclude instructions for flowing a process gas of an appropriatecomposition, as was previously described, and generating a plasma usingappropriate power levels (e.g., with LF/HF power ratio of at least about1.5. In other embodiments, the controller includes program instructionsfor depositing a GeN_(x) hardmask, which include instructions forflowing a process gas comprising a germanium-containing precursor and anitrogen-containing precursor at flow rates, that preferably result information of a film containing at least about 60 atomic % germanium. Thecontroller may comprise different or identical instructions fordifferent apparatus stations, thus allowing the apparatus stations tooperate either independently or synchronously.

It is understood that the examples and embodiments described herein arefor illustrative purposes only and that various modifications or changesin light thereof will be suggested to persons skilled in the art.Although various details have been omitted for clarity's sake, variousdesign alternatives may be implemented. Therefore, the present examplesare to be considered as illustrative and not restrictive, and theinvention is not to be limited to the details given herein, but may bemodified within the scope of the appended claims. It is understood, thatin certain embodiments the hardmask film may not necessarily be activelyused for masking in lithography, but may simply serve as a hardprotective layer for underlying materials.

What is claimed is:
 1. A method of forming a hardmask film on asemiconductor substrate, the method comprising: receiving thesemiconductor substrate in a plasma-enhanced chemical vapor deposition(PECVD) process chamber; and forming a hardmask film having a hardnessof greater than about 12 GPa, and a stress of between about −600 MPa and600 MPa by PECVD on the semiconductor substrate, wherein the PECVDhardmask deposition process comprises: depositing undoped multi-layersilicon carbide film using multiple densifying plasma treatments, thedeposition comprising; (a) introducing a process gas comprising asaturated silicon-containing precursor into the process chamber andforming a plasma to deposit a first sublayer of the silicon carbidehardmask film; (b) removing the saturated silicon-containing precursorfrom the process chamber; (c) introducing a plasma treatment gas intothe process chamber and treating the substrate with plasma to densifythe deposited sublayer; and (d) repeating (a)-(c) to form and densifyadditional sublayers of silicon carbide.
 2. The method of claim 1,wherein the film has a stress of between about −300 MPa and 300 MPa. 3.The method of claim 1, wherein the film has a stress of between about 0MPa and 600 MPa.
 4. The method of claim 1, wherein the film has ahardness of at least about 16 GPa.
 5. The method of claim 1, wherein thefilm has a modulus of at least about 100 GPa.
 6. The method of claim 1,wherein the saturated silicon-containing precursor comprisestetramethylsilane (Me4Si).
 7. The method of claim 1, wherein the processgas used during deposition further comprises a carrier gas selected fromthe group consisting of He, Ne, Ar, Kr, and Xe.
 8. The method of claim1, wherein the plasma treatment gas is selected from the groupconsisting of He, Ar, CO2, N2, NH3, and H2.
 9. The method of claim 1,wherein the thickness of each sublayer is less than about 100 Å.
 10. Themethod of claim 9, wherein the method comprises depositing at least 10sublayers.
 11. The method of claim 1, wherein in the formed siliconcarbide film the ratio of areas of SiC peak in the IR spectrum relativeto SiH peak is at least about 20 and the ratio of areas of SiC peak inthe IR spectrum relative to CH peak is at least about
 50. 12. The methodof claim 1, wherein the formed silicon carbide film has a density of atleast about 2 g/cm3.
 13. The method of claim 1, wherein the formedhardmask layer is deposited over a layer of dielectric having adielectric constant of less than about 2.8, and wherein the formedhardmask film has an etch selectivity of at least about 8:1 versus thedielectric in a dry plasma etch.
 14. The method of claim 1, wherein theformed hardmask layer is deposited over a layer of polysilicon.
 15. Themethod of claim 1, wherein the hardmask is formed at a temperature ofless than about 400° C.